Patents and Certifications
Surpassing global standards and certifications
Our solutions and proprietary IP exceed global standards and industry certifications. We proudly enable smart card issuance with major global payment networks.
Select Industry Certifications
sAiL™ dual inlay certified for contributing to carbon footprint reduction in accordance to Mastercard Card Eco Certification Scheme (CEC) – demonstrated 46% reduction in total energy consumption and 47% reduction in CO2 equivalent footprint
Since 2021
BRAVO™ module certified for contributing to carbon footprint reduction in accordance to Mastercard Card Eco Certification Scheme (CEC) – demonstrated 23% reduction in total energy consumption and 24% reduction in CO2 equivalent footprint
2019-2022 ISO-9001:2015 Certification
Manufacturer for IC Modules, Inlay, and RFID Packaging, Including Testing and Loading of Operating Systems
Since 2004
2019-2022 ISO-14001:2015 Certification
Manufacturer for IC Modules, Inlay, and RFID Packaging, Including Testing and Loading of Operating Systems
Since 2007
2022 EAL6 Certification
One of two IC module assembly companies globally to receive EAL 6 common criteria information technology security assessment and certification
MasterCard CQM Certification
Card Quality Management certification for Smart Card Products and Services for banking modules
Since 2009
MasterCard CCS Devices Approval
partner program
Novoflex works with payments and technology partners globally to:
- Bring new innovations to market
- Achieve industry standards and interoperability certifications
- Drive value for end-user customers
Proprietary IP and Global Patents
We are proud to have been granted global patent registrations for our proprietary technologies and innovative solutions.
sAiL™ For Contactless Bankcard Payments
Laminate custom chip design solution with contactless/dual interface (sAiL.DUAL™)
Patents Granted in 16+ Countries
- Australia
- Canada
- China
- European Patent Office
- Hong Kong
- Japan
- Nigeria
- Philippines
- Russian Federation
- Singapore
- South Korea
- South Africa
- Americas (U.S., Mexico (allowed *) & Brazil)
- Ukraine
Patents Pending in 4 Countries
- ASEAN (Indonesia, Thailand & Vietnam)
- India
sAiL™ For Communications
Laminate SIM™ chip solution for telecommunications (sAiL.SIM™)
Patents Granted in 24+ Countries
- ASEAN (Indonesia, Malaysia, Philippines, Thailand & Vietnam)
- Rest of Asia (China, India and Myanmar )
- Mexico
- European Patent Office
- Europe (Belgium, Czech Republic, Greece, Germany, France, Italy, Netherlands, Poland, Portugal, Romania, Spain, Switzerland, Turkey & United Kingdom)
Patents Pending in 1 Country
- Brazil
BRAVO
Patents Granted in 11 Countries
- Australia
- Canada
- China
- Japan
- Nigeria
- Philippines (allowed)*
- Russian Federation
- Singapore
- South Africa
- South Korea
- Ukraine
Patents Pending in 8+ Countries
- European Patent Office**
- ASEAN (Indonesia, Thailand & Vietnam)
- India
- Americas (Brazil, Mexico & U.S.)